Senior PCB Layout Engineer Verified today

About the Role

As part of the RF Payload Design team, you will design complex PCBs with thousands of high-ball-count custom BGA devices featuring mmWave, RF, and mixed-signal interconnects. You will conduct PCB stackup feasibility and trace routability studies to inform payload architectural trades, and lead the PCB OK2FAB process including DRC checks, design release, and fabrication drawing preparation.

Responsibilities

• Design multi-layer PCBs for mmWave and microwave RF, complex digital, mixed-signal and high power systems including FPGAs and Microcontrollers
• Develop PCB layouts for Digital/Analog/RF circuits with careful attention to impedance control, loss tangent, and electromagnetic compatibility
• Perform signal integrity analysis for high-speed digital interfaces (PCIe, DDR, Ethernet)
• Create component libraries, design rule checks (DRCs), and maintain design standards
• Collaborate with electrical engineers on component selection, schematic review, and design optimization
• Generate fabrication and assembly documentation including Gerber files, drill files, and assembly drawings
• Work with PCB fabricators and CM vendors to ensure manufacturability and resolve fabrication issues
• Support board bring-up activities and debug hardware issues related to PCB design
• Design for space environment considerations including thermal management, radiation tolerance, and mechanical stress

Minimum Qualifications

• B.S. in Electrical Engineering, Computer Engineering, or related field with 5+ years of PCB design experience
• Proficiency with PCB design tools (Altium Designer preferred, Cadence Allegro, or similar)
• Strong understanding of signal integrity principles for high-speed digital design (transmission lines, termination, crosstalk)
• Experience with higher layer count HDI board design with dense fanout and routing
• Experience with controlled impedance design and PCB stackup optimization
• Experience with high voltage layout design including creepage clearance and thermal management
• Knowledge of EMI/EMC best practices and design guidelines
• Familiarity with IPC standards (IPC-2221, IPC-6012, IPC-A-610)
• Experience with PCB layout for FPGAs, high-speed ADCs/DACs, or mixed-signal designs

Preferred Qualifications

• Experience with RF/microwave PCB design using high-frequency laminates (Rogers, Taconic, etc.)
• Knowledge of power integrity analysis tools (HyperLynx, Ansys SIwave, Cadence Sigrity)
• Familiarity with thermal analysis tools and thermal management techniques for high-power electronics
• Experience designing for space environment (vacuum, thermal cycling, radiation, vibration)
• Understanding of design for manufacturing (DFM) and design for test (DFT) principles
• Knowledge of conformal coating, potting, and other space-qualification techniques
• Previous experience with aerospace or satellite PCB designs
• Familiarity with MIL-STD or NASA standards for PCB design

Compensation

Base pay range for CA and WA applicants: $197,529.00 to $276,539.55. Other site ranges may differ.

Requirements

Applicants must be a U.S. citizen or national, U.S. permanent resident (Green Card holder), or lawfully admitted as a refugee or granted asylum.

Blue's Standard Background Check is required for all positions.