High-Speed Electro-Optical IC Engineer (RFIC Engineering) Verified today

SpaceX · Redmond, WA · Payload · first seen 2026-07-22

Role

SpaceX is seeking an Electrical-Optical Silicon Photonics IC Engineer to develop next-generation Photonics ICs (PIC) and Electrical ICs (EIC) for deployment in Starlink's space and ground infrastructure. These chips enable broadband connectivity globally. You will work with systems architects, DSP engineers, electro-optics specialists, and ASIC teams to design, simulate, and bring to production world-class high-speed optical link solutions.

Responsibilities

Design, simulate and model electro-optical building blocks for silicon photonics solutions
Design, simulate and model RF, analog and mixed-signal circuits and systems
Derive specifications for Photonics IC and Electrical IC subsystems and circuits
Develop Analog, Mixed-Signal, RF and Microwave circuits in SiGe or CMOS processes
Partition functions between hardware and software domains with system architects and engineers
Perform IC floor planning and layout
Model package and external parasitic components
Evaluate, characterize and measure electrical and optical building blocks of high-speed optical link solutions
Assist in developing automated test lab equipment for measurements
Work with manufacturing engineers on production testing and qualification of EIC and PIC components

Basic Qualifications

Bachelor's degree in Electrical Engineering, Computer Engineering, or Computer Science
2+ years of photonics or electro-optical integrated circuit design experience

Preferred Skills and Experience

Master's degree or PhD in Electrical Engineering or Computer Engineering with emphasis in electro-optics integrated circuit design
Experience with Spectre, ADS, HFSS, Momentum, Ansys Lumerical, or COMSOL simulation tools
Photonics design and analysis of MZM and Microring modulators, Ge photodiodes, dWDM filters, waveguides, couplers, dividers and polarization management circuitry
Electrical circuit design and simulation of high bandwidth modulator drivers, TIAs, CTLEs, filters, low noise amplifiers and power amplifiers
Advanced packaging technology for optical engine integration in co-package optics (CPO) solutions
Wideband circuit design for high-speed Serdes links exceeding 100 Gbps data rate with bandwidth exceeding 10s of GHz
High-speed SerDes architecture, NRZ and PAM4 modulation schemes, and link protocol knowledge
High-speed optical and RF test equipment including spectrum analyzers, vector signal analyzers, oscilloscopes and BERTs
EIC and PIC performance characterization for high-speed optical Serdes

Additional Requirements

Ability to work long hours and weekends as necessary to support critical milestones

Compensation

Level 1: $125,000 - $165,000 per year

Level 2: $145,000 - $200,000 per year

Actual level and salary determined on case-by-case basis based on job-related knowledge, skills, education and experience.

Benefits include long-term stock incentives or cash awards, discretionary bonuses, Employee Stock Purchase Plan, comprehensive medical, vision and dental coverage, 401(k) retirement plan, disability and life insurance, paid parental leave, 3 weeks paid vacation, 10+ paid holidays annually. Washington State employees accrue paid sick time per state and federal law. Company shuttles available from select Seattle locations to Redmond office Monday to Friday.

ITAR Requirement

Applicant must be a U.S. citizen or national, U.S. lawful permanent resident, Refugee under 8 U.S.C. Section 1157, or Asylee under 8 U.S.C. Section 1158, or be eligible to obtain required authorizations from the U.S. Department of State.