Sr. High-Speed Electro-Optical IC Engineer (RFIC Engineering) Verified today
Sr. High-Speed Electro-Optical IC Engineer (RFIC Engineering)
SpaceX is developing Starlink, the world's largest satellite constellation delivering fast, reliable broadband internet globally. We design, build, test and operate all parts of the system: satellites, consumer receivers and software. You will join cross-disciplinary teams to develop next-generation photonic and electrical ICs for deployment in space and ground infrastructure.
What you will do
- Design, simulate and model electro-optical building blocks for silicon photonics solutions
- Design, simulate and model RF, analog and mixed-signal circuits and systems
- Derive specifications for photonics IC and electrical IC subsystems and circuits
- Develop analog, mixed-signal, RF and microwave circuits in SiGe or CMOS processes
- Work with system architects, DSP and electro-optics, and ASIC engineers to partition functions between hardware and software
- Perform IC floor planning and layout
- Model package and external parasitic components
- Evaluate, characterize and measure electrical and optical building blocks of high-speed optical link solutions
- Assist in developing automated test lab equipment for measurements
- Work with manufacturing engineers on production testing and qualification of EIC and PIC components
Required qualifications
- Bachelor's degree in electrical engineering, computer engineering, or computer science
- 5 or more years of photonics or electro-optical integrated circuit design
Preferred qualifications
- Master's degree or PhD in electrical engineering or computer engineering with emphasis in electro-optics integrated circuit design
- Experience with Spectre, ADS, HFSS, Momentum, Ansys Lumerical or COMSOL simulation tools
- Photonics design skills including MZM and microring modulators, Ge photodiodes, dWDM filters, waveguides, couplers, dividers and polarization management
- Electrical circuit design for high-bandwidth modulator drivers, transimpedance amplifiers, CTLEs, filters, low-noise and power amplifiers
- Knowledge of advanced packaging technology for optical engine integration in co-package optics (CPO) solutions
- Experience with wideband circuit designs supporting high-speed SerDes links exceeding 100 Gbps with bandwidth of 10s of GHz
- Familiarity with high-speed SerDes architecture, NRZ and PAM4 modulation schemes and link protocols
- Experience with optical and RF test equipment: spectrum analyzers, vector signal analyzers and generators, high-speed oscilloscopes and BERTs
- Experience characterizing EIC and PIC performance for high-speed optical SerDes
Additional requirements
- Ability to work long hours and weekends as necessary to support critical milestones
Compensation and benefits
Base salary range Level 3: $165,000 to $270,000. Actual level and base salary determined case-by-case based on job-related knowledge and skills, education and experience.
Total rewards include long-term incentives in company stock or long-term cash awards, potential discretionary bonuses, Employee Stock Purchase Plan at a discount, comprehensive medical, vision and dental coverage, 401(k) retirement plan, short and long-term disability insurance, life insurance, paid parental leave. You will accrue 3 weeks paid vacation and be eligible for 10 or more paid holidays per year. Employees in Washington State accrue paid sick time per state and federal law. Company shuttles offered for roundtrip travel from select Seattle locations to the Redmond office Monday to Friday.
US person requirement
To conform to U.S. Government export regulations (ITAR), applicant must be a U.S. citizen or national, U.S. lawful permanent resident (green card holder), Refugee under 8 U.S.C. 1157, or Asylee under 8 U.S.C. 1158, or be eligible to obtain required authorizations from the U.S. Department of State.