Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind) Verified today

SpaceX · Bastrop, TX · Mechanical · first seen 2026-07-23

Sr. Packaging Engineer - Thermal Materials, AI Satellites (Starmind)

SpaceX is developing Starmind, a constellation of satellites capturing solar energy in space to power low-cost, high-performance AI compute for Earth. You'll work on highly reliable electrical compute hardware, solar power systems, and thermal radiators that operate in the extreme environment of space.

As Sr. Packaging Engineer on the Starmind team, you will own the entire lifecycle of advanced packaging that enables on-orbit AI processing and data center workloads. Your work spans process, packaging, materials, and thermal engineering, sitting at the intersection of custom compute electronics, memory, and networking design.

Responsibilities

Own full lifecycle of advanced packaging through board assembly process development: requirements capture, materials selection, prototyping, process optimization, manufacturing, and failure analysis
Drive system trades, materials selection, and manufacturing process optimization
Develop integrated thermal solutions and next-generation thermal interface materials (TIMs) to improve package performance
Manage equipment specification, qualification, and manufacturing ramp
Build supply chains for die, packages, components, consumable chemicals, and equipment; define incoming acceptance criteria
Work across disciplines (mechanical, thermal, materials, electrical, software, test, supply chain, silicon design) to deliver integrated, high-performance hardware
Drive failure analysis, challenge assumptions, and learn from mistakes with an open mindset
Collaborate with leadership across design, reliability, production, and supply chain teams
Manage compliance risks and ensure safety and environmental standards compliance
Mentor and develop engineers with technical guidance and project oversight

Basic Qualifications

Bachelor's degree in materials science, mechanical engineering, or similar discipline
5+ years experience in microelectronics device research or manufacturing

Preferred Skills and Experience

Experience in hardware, robotics, automation, or manufacturing environments
Experience designing tooling, fixtures, or jigs for assembly or test applications
Scripting or data analysis tools (MATLAB, JMP, or equivalent) for process data analysis or automation
Work with precision assemblies, robotic systems, or automated pick-and-place equipment
Manufacturing process development methodologies (PFMEA, process capability studies, SPC)
GD&T and tolerance analysis as applied to fixture and tooling design
Production data systems, MES, or manufacturing traceability infrastructure
Cleanroom or controlled-environment manufacturing practices

Additional Requirements

Ability to work extended hours or weekends as needed for mission-critical deadlines
Occasional travel may be required

ITAR Requirement

To conform to U.S. Government export regulations, applicant must be a U.S. citizen or national, U.S. lawful permanent resident (green card holder), Refugee under 8 U.S.C. § 1157, or Asylee under 8 U.S.C. § 1158, or be eligible to obtain required authorizations from the U.S. Department of State.